Subtractive vs Hybrid CNC-AM bakeng sa Tokiso ea Lisebelisoa

PFT, Shenzhen

Boithuto bona bo bapisa katleho ea machining ea setso ea CNC le lebasetere le hlahang la CNC-Additive Manufacturing (AM) bakeng sa tokiso ea lisebelisoa tsa indasteri. Lintlha tsa ts'ebetso (nako ea ho lokisa, tšebeliso ea thepa, matla a mochini) li ile tsa lekoa ho sebelisoa liteko tse laoloang mabapi le lefu le senyehileng la setempe. Liphetho li bonts'a mekhoa e nyalisitsoeng e fokotsa litšila tsa thepa ka 28-42% le ho khutsufatsa lipotoloho tsa tokiso ka 15-30% khahlano le mekhoa ea ho fokotsa feela. Tlhahlobo ea microstructural e tiisa matla a ts'oanang a ts'ebetso (≥98% ea sesebelisoa sa pele) likarolong tse lokisoang ka lebasetere. Moeli oa mantlha o kenyelletsa lithibelo tsa ho rarahana ha jiometri bakeng sa deposition ea AM. Liphuputso tsena li bonts'a lebasetere la CNC-AM e le leano le sebetsang la ho boloka lisebelisoa tse tšoarellang.

1 Selelekela

Ho senyeha ha lisebelisoa ho bitsa liindasteri tsa tlhahiso $240B selemo le selemo (NIST, 2024). Tokiso ea CNC ea setso e tlosa likarolo tse senyehileng ka ho sila, hangata e lahla> 60% ea thepa e ka pholosoang. Khokahano ea Hybrid CNC-AM (ho beha matla ka kotloloho ho lisebelisoa tse teng) e ts'episa ts'ebetso ea lisebelisoa empa e haelloa ke netefatso ea indasteri. Patlisiso ena e lekanya melemo ea ts'ebetso ea hybrid workflows khahlano le mekhoa e tloaelehileng ea ho tlosa bakeng sa tokiso ea lisebelisoa tsa boleng bo holimo.

2 Mokhoa

2.1 Moralo oa Teko

Litšepe tse hlano tse senyehileng tsa H13 li shoa (litekanyo: 300 × 150 × 80mm) li bile le mekhoa e 'meli ea tokiso:

• Sehlopha sa A (se nyenyefatsang):
  - Ho tlosa tšenyo ka 5-axis milling (DMG MORI DMU 80)
  - Deposition ea li-welding filler (GTAW)
  - Qetella machining ho CAD ea mantlha

• Sehlopha sa B (Sehlopha sa Hybrid):
  - Ho tlosoa ha bofokoli bo fokolang (<1mm botebo)
  - Tokiso ea DED e sebelisa Meltio M450 (316L terata)
  - Adaptive CNC remachining (Siemens NX CAM)

2.2 Ho Fumana Boitsebiso

• Katleho ea Lintho tse bonahalang: Litekanyo tsa boima pele / ka mor'a tokiso (Mettler XS205)

• Ho latela nako: Ho lekola ts'ebetso ka li-sensor tsa IoT (ToolConnect)

• Teko ea Mechini:
  - 'Mapa o thata (Buehler IndentaMet 1100)
  - Mehlala ea tensile (ASTM E8/E8M) ho tsoa libakeng tse lokisitsoeng

3 Liphetho & Analysis

3.1 Tšebeliso ea Mehloli

Lethathamo la 1: Papiso ea Metrics ea Ho Lokisa

3.2 Botšepehi ba Mechini

Mehlala e lokisitsoeng ea Hybrid e bonts'itsoe:

• Ho thatafala ho tsitsitseng (52–54 HRC vs. original 53 HRC)

• Matla a ho qetela: 1,890 MPa (± 25 MPa) - 98.4% ea lisebelisoa tsa motheo

• Ha ho na delamination ea sefahleho litekong tsa mokhathala (lipotoloho tse 10⁶ ho 80% khatello ea lihlahisoa)

Setšoantšo sa 1: Microstructure ea hybrid interface interface (SEM 500×)
Tlhokomeliso: Sebopeho sa lijo-thollo tse lekanang moeling oa fusion se bontša taolo e sebetsang ea mocheso.

4 Puisano

4.1 Liphello tsa Ts'ebetso

Phokotso ea nako ea 28.9% e bakoa ke ho felisa ho tlosoa ha thepa e ngata. Hybrid processing e bonahala e le molemo bakeng sa:

• Lisebelisoa tsa lefa tse nang le thepa e khaotsoeng

• Li-geometri tse rarahaneng haholo (mohlala, likanale tsa ho pholisa tse lumellanang)

• Maemo a ho lokisoa ha molumo o tlase

4.2 Litšitiso tsa Tekniki

Meeli e hlokometsoeng:

• Boholo ba angle ea ho beha: 45° ho tloha holimo (e thibela bofokoli ba overhang)

• Phapang ea botenya ba DED: ± 0.12mm e hlokang litselana tsa lisebelisoa tse ikamahanyang le maemo

• Kalafo ea HIP ea kamora ts'ebetso e bohlokoa bakeng sa lisebelisoa tsa boemo ba sefofane

5 Qetello

Hybrid CNC-AM e fokotsa tšebeliso ea lisebelisoa tsa ho lokisa lisebelisoa ka 23-42% ha e ntse e boloka ho lekana ha mochini le mekhoa ea ho tlosa. Ts'ebetsong e khothaletsoa bakeng sa likarolo tse nang le boima bo leka-lekaneng ba geometri moo ho boloka thepa ho lokafatsang litšenyehelo tsa ts'ebetso ea AM. Lipatlisiso tse latelang li tla ntlafatsa maano a ho beha litšepe tsa lisebelisoa tse thata (> 60 HRC).