Lihokelo tsa Copper tsa Micro-Scale CNC bakeng sa Tlhahiso e Phahameng ea Marang-rang ea Elektronike

Indastering ea elektronike e ntseng e fetoha ka potlako, tlhokahalo eamaqhubu a phahameng, lihokelo tse sebetsang hantlee ntse e eketseha, e tsamaisoa ke tsoelo-pele ea meaho ea 5G, litsi tsa data tse tsamaisoang ke AI, le lits'ebetso tsa IoT. Joalo ka moetsi ea tšepahalang ea sebetsanang lelihokelo tsa koporo tse nyane tsa CNC, feme ea rona e kopanya theknoloji e tsoetseng pele, taolo e matla ea boleng, le lilemo tse mashome tsa boitseanape ho fana ka likarolo tse finyellang litekanyetso tse nepahetseng tsa lisebelisoa tsa morao-rao tsa elektronike tse phahameng.

Hobaneng re Khetha Lihokelo tsa rona tsa CNC Copper?

1. Advanced Manufacturing bokgoni

Mehala ea rona ea tlhahiso e na le lisebelisoaLitsi tsa machining tsa CNC tsa 5-axislelilathe tsa mofuta oa Switzerland tse nepahetseng haholo, e re nolofalletsang ho fihlela mamello e tiileng joalo ka± 0.001mm. Mechini ena e lekantsoe ka ho khetheha bakeng sa ho sebetsa ka koporo e se nang oksijene (OFC), thepa e ratoang bakeng sa conductivity ea eona e phahameng le tahlehelo e nyane ea matšoao lits'ebetsong tse phahameng haholo. Ka ho kopanyatsamaiso ea nako ea sebele ea ho shebella, re etsa bonnete ba hore sehokelo se seng le se seng se kopana le lintlha tse thata tsa boholo le tsa motlakase.

2. Mekhoa ea Kalafo ea Bokaholimo ea Proprietary

Ho matlafatsa ts'ebetso le botsitso ba matšoao, rea sebelisaplating ea nickel e se nang motlakaseleho qoelisoa ka khauta. Ts'ebetso tsena li fokotsa oxidation ea bokaholimo le tahlehelo ea ho kenya, e bohlokoa bakeng sa lihokelo tse sebetsang ho10-40 GHz marang-rang. Mohlala, thekenoloji ea rona ea "ShieldCoat™" e netefalitsoe e lelefatsa nako ea bophelo ea sehokelo ka 30% libakeng tse thothomelang haholo, joalo ka ha ho netefalitsoe ke liteko tsa laboratoring tsa mokha oa boraro.

3. Tiisetso ea Boleng bo Tiileng

Sehlopha se seng le se seng se feta aProtocol ea tlhahlobo ea mehato e 12, ho kenyelletsa:

•3D metrology scansbakeng sa ho nepahala ha dimensional
•Time-domain reflectometry (TDR)ho lekanya botsitso ba impedance
•Liteko tsa libaesekele tse futhumetseng(-55 ° C ho 125 ° C) ho etsisa maemo a feteletseng
Boitlamo bona ba boleng bo re fumanetse litifikeiti tse kangIATF 16949leISO 13485, ho etsa bonnete ba hore ho latela litekanyetso tsa indasteri ea likoloi le tsa bongaka.

Litharollo tse entsoeng bakeng sa lisebelisoa tse fapaneng

Sehlahisoa sa rona se kenyelletsa:

•Lihokelo tsa board-to-boardbakeng sa liteishene tsa motheo tsa 5G
•Lihokelo tse nyane tsa RF coaxialbakeng sa lifofane tsa sefofane
•Li-interposer tse entsoeng ka mokhoa o ikhethilengbakeng sa li-GPU tsa seva tsa AI

Phuputso ea morao tjena e totobatsa kamoo ronaLikhokahanyo tsa koporo tsa 0.8mm-pitche rarollotse litaba tsa botšepehi ba matšoao tsamaisong ea LiDAR ea moreki oa likoloi oa Tier-1, e fokotsa ho kopana ka 45% le ho nolofalletsa phetiso ea data ka potlako.