5-Axis Milled Ceramic Insulators bakeng sa Thepa ea Semiconductor le Likamore tse Hloekileng

Lefats'eng la maemo a holimo la tlhahiso ea semiconductor le tikoloho ea likamore tse hloekileng, karolo e 'ngoe le e' ngoe e tlameha ho fana ka ts'ebetso e se nang sekoli. HoPFT, re ikhethela ho etsa mesebetsi ea matsoho5-axis milled ceramic insulatorstse hlalosang bocha ho nepahala le ho tšepahala. Ka ba fetang 20+lilemo tsa boiphihlelo, litharollo tsa rona li etselitsoe ho fihlela litlhoko tse nepahetseng tsa lisebelisoa tsa semiconductor, ho netefatsa botsitso ba mocheso, ho kenya motlakase, le ts'ebetso e se nang tšilafalo maemong a thata haholo.

Hobaneng re Khetha Li-insulators tsa rona tsa 5-Axis Milled Ceramic?

1.Matla a Tsoetseng Pele a Tlhahiso

Setsi sa rona se na le lisebelisoaMechini ea morao-rao ea 5-axis CNC e silang, e nolofalletsang ho nepahala ha boemo ba micron ho bopeng lirafshoa tse tsoetseng pele tse kang alumina (Al₂O₃), silicon carbide (SiC), le aluminium nitride (AlN). Ho fapana le mekhoa e tloahelehileng, 5-axis machining e lumella lijeometri tse rarahaneng — tse bohlokoa bakeng sa likarolo tse kang lithapo tsa phahamiso, likarolo tsa kamore ea deposition, le li-insulator tse hananang le plasma.

Likarolo tsa Bohlokoa:

•Nepahalo:± 0.005mm mamello bakeng sa ho kopanngoa ka mokhoa o se nang moeli ho lisebelisoa tsa lithography tsa ASML kapa mekhoa ea Lam Research etch.
•Material Versatility:E etselitsoe 99.8% alumina, SiC e hloekileng haholo, le lirafshoa tse ling tse tsoetseng pele.
•Surface Finish:Ra <0.2μm ho fokotsa tlhahiso ea likaroloana ka har'a likamore tsa bohloeki tsa Sehlopha sa 1 sa ISO.

2.Proprietary Process Engineering

Baenjiniere ba rona ba ntlafalitseditaolo tsa tshebetso e koetsoenge ikamahanyang le brittleness ea ceramic nakong ea machining. Ka ho kopanya mekhoa ea ho sila e omileng le ho thothomela ha nako ea sebele, re finyella libaka tse se nang crack le nako e telele ea bophelo ea likarolo-esita le tlas'a libaesekele tse chesang haholo (ho fihla ho 1,600 ° C).

Innovation Spotlight:

•Melao-motheo ea ho imolla khatello ea maikutlo:Fokotsa li-micro-fractures ho li-insulators tsa AlN bakeng sa lits'ebetso tsa CVD.
•Kalafo ea Post-Machining:HIP (Hot Isostatic Pressing) e matlafatsa letsoalo le ho hanyetsa ho bola.

3.Tiisetso e Matla ea Boleng

Insulator e 'ngoe le e' ngoe e ea sebetsa12-mohato oa ho hlahloba, ho kenyelletsa:

•CMM (Mochini o lekanyang oa Coordinate)netefatso ea litekanyo tse mahlonoko.
•Teko ea ho lutla ha Heliumbakeng sa ho tsamaellana le vacuum.
•EDS (Energy-Dispersive X-ray Spectroscopy)ho netefatsa bohloeki ba lintho tse bonahalang.

Ea ronaSistimi e netefalitsoeng ea ISO 9001/14001e netefatsa ts'ebetso ho tloha ho theko ea thepa e tala (e tsoang ho barekisi ba Tier 1 joalo ka CoorsTek) ho ea ho sephutheloana sa ho qetela.

Lisebelisoa: Moo Precision e Kopanang le Ts'ebetso

Li-insulator tsa rona li tšeptjoa ho:

•Lisebelisoa tsa Etch & Deposition:Likarolo tse koahetsoeng ke SiC bakeng sa ho hanyetsa plasma ho li-module tsa Applied Materials™.
•Li-Ion Implanters:Lithakhisa tsa Alumina tse phahamisang tse nang le li-anti-static coatings ho thibela ho thella ha sephaphatha.
•Sistimi ea Metrology:Li-insulator tse eketsang mocheso o tlase bakeng sa mekhahlelo ea lithography ea EUV.

Thuto-pale:OEM e etellang pele ea semiconductor e fokolitse nako ea ho theoha ha sesebelisoa ka 40% ka mor'a ho fetohela ho lishaoara tsa rona tse entsoeng ka tloaelo tsa SiC, tse neng li sebetsa hantle ho feta likarolo tsa bahlolisani ho 300mm wafer processing.

Ka Ntle ho Tlhahiso: Mokhoa oa Tšebelisano

•Prototyping e potlakileng:Kenya lifaele tsa hau tsa CAD 'me u fumane li-prototype tse sebetsang ka matsatsi a 7.
•Sephutheloana sa Kamore ea Bohloeki Setšeng:Kopano ea kamore e hloekileng ea Sehlopha sa 10 bakeng sa ho kopanya lisebelisoa ka kotloloho.
•Tšehetso ea Theknoloji ea Bophelo Bohle:Baenjineri ba rona ba fana ka lits'ebeletso tsa tlhahlobo ea moaparo le lits'ebeletso tsa botjha ho holisa likarolo tsa bophelo.